bonding in Dresden
Start Your Career at Detecon
The bonding contact fair is one of the largest recruiting events organized by students: On three days you will be able to get to know over 300 exhibitors from the fields of engineering, economics and natural sciences. You will have the opportunity to get in touch with company representatives from your dream company in order to get one step closer to your dream job, internship, thesis or your stay abroad.
Why you should come by
✔ You are about to complete your studies
✔ You have a desire to enter the field of consulting
✔ You want to get to know Detecon as one of several consultancies
✔ At best, you have already completed your first internships in consulting
✔ You want to give yourself the chance to get one step closer to your professional ideas
Don't wait for tomorrow, seize your chance now.
We are looking forward to finally getting to know you!
Everything You Need to Know
Date: 04.18. - 04.20.2023
Location:
Campus of TU Dresden
Mommsenstraße
01069 Dresden
Visiting the event is free.
For any further questions, feel free to contact us! (career@detecon.com)
